MTE670T
Transcend's MTE670T M.2 SSD features PCI Express (PCIe) Gen 3 x4 interface and supports NVM Express (NVMe) 1.3 specifications for never-before-seen transfer speeds. The MTE670T features next-generation 3D NAND technology, which enables 112 layers of 3D NAND flash chips to be stacked vertically. Compared to 96-layer 3D NAND, this density advancement greatly improves storage efficiency. Applied with a PCB with 30µ" gold connection pins and Corner Bond technology, the MTE670T is fully tested in-house to ensure reliability in mission-critical applications, with a P/E endurance rating of 3K cycles and an extended operating temperature range of -20℃ ~ 75℃.
Firmware features
- Supports NVM commands
- SLC cache technology
- Dynamic thermal throttling
- LDPC ECC (Error Correction Code) function Integrated
- Advanced Global Wear Leveling and Defective Block Management for Reliability
- Advanced Garbage Collection
- Enhanced S.M.A.R.T. function for durability
- TRIM command for better performance
Hardware features
- Complies with RoHS standards
- Compliant with NVM Express 1.3 specifications
- Compliant with PCI Express 3.1 specifications
- M.2 form factor (80mm) - ideal for mobile computing devices
- PCIe Gen 3 x 4 interface
- Endurance: 3K cycles P/E (Program/Delete) guaranteed
- The main components are factory reinforced with Corner Bond technology.
- PCB has 30µ thick gold connection pins
- Power Shield (PS) to ensure data transfer integrity and minimise data corruption in the drive during an abnormal power outage
- Extended temperature (-20°C ~ 75°C) and Wide temperature (-40°C ~ 85°C) options available
- Supports Transcend's Scope Pro software
Specifications
Appearance |
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| Dimensions | 80 mm x 22 mm x 2.23 mm (3.15″ x 0.87″ x 0.08″) |
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| Weight | 9 g (0.32 oz) |
| Form Factor |
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| Type M.2 |
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Interface |
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| Bus Interface |
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Storage |
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| Flash Type |
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| Capacity |
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Operating Environment |
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| Operating Voltage |
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| Operating Temperature |
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| Storage Temperature | -40°C (-40°F) ~ 85°C (185°F) |
| Humidity | 5% ~ 95% |
| Hit |
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| Vibration (Operating) | 20 G (Peak-to-Peak), 7 Hz ~ 2,000 Hz (frequency) |
Feeding |
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| Power consumption (Operating) | 3.1 watt(s) |
| Energy consumption (IDLE) | 0.4 watt(s) |
Performance |
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| Sequential Read / Write (CrystalDiskMark) | Read: Up to 2,100 MB/s Write: Up to 1,600 MB/s |
| 4K Random Read / Write (IOmeter) | Read: Up to 150,000 IOPS Write: Up to 280,000 IOPS |
| Mean Time Between Failures (MTBF) | 3,000,000 hour(s) |
| Terabytes Written (TBW) | Up to 960 TBW |
| Number of Discs Written Per Day (DWPD) | 0.88 (3 years) |
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